A5103901982- Advanced MEMS and NEMS Technologies
- Advanced Sensor and Energy Harvesting Materials
- Nanofabrication and Lithography Techniques
- Cell Image Analysis Techniques
- Nanomaterials and Printing Technologies
- Advanced Surface Polishing Techniques
- Digital Imaging for Blood Diseases
- Advanced Battery Technologies Research
- Additive Manufacturing and 3D Printing Technologies
- Image Processing Techniques and Applications
- 3D IC and TSV technologies
- Various Chemistry Research Topics
- Advancements in Battery Materials
- Photonic and Optical Devices
Yantai University
2021
China Aerospace Science and Technology Corporation
2020
University of Washington
2011-2012
Our research team has developed a 2D micro image display device that can potentially overcome the size reduction limits while maintaining high-image resolution and field of view obtained by mirror-based systems. The basic design optical scanner includes microfabricated SU-8 cantilever waveguide is electromechanically deflected piezoelectric actuator. From distal tip waveguide, light beam emitted direction propagation displaced along two orthogonal directions. waveforms for actuator LED...
To deliver state-of-the-art battery knowledge to undergraduates, we designed a feasible experiment prepare flexible packaging batteries, aiming reproduce industrial batteries in general chemistry laboratories. In our procedure, the materials involved are inexpensive, safe, and easy use. No organic solvents or toxic chemicals required, nor is severe drying laboratory glovebox. The fabricated have similar structure commercial evaluated by charge–discharge technique. This experimental design...
Hermeticity of MEMS wafer packaging has a major impact on the performance and reliability devices. The test for hermeticity is usually based method from MIL-STD-883. However, both theory experiment have shown that this standard great limitations cavities. Raman spectroscopy also been used to obtain quantitative qualitative information about molecular composition in small cavity packages then determine leak rate packages. reliant package cap being transparent probing light requires reflective...
In this paper, we present our preliminary results of high aspect ratio 3D PEDOT pillar study by drop-on demand (DOD) direct printing system. Design the experimental setup and fabrication DOD are introduced. Currently, system can achieve a with height 300 μm 80 in diameter. The proposed process has wide range potential applications eletronics display industry.