Significant Enhancement in Dielectric Properties of Polyimide Alloys Through a Two‐Phase Interlocking Structure

• DOI: 10.1002/adfm.202313258
• Publication Date: 2024-01-27T06:59:52Z
• Authors: Man Liu; Jinhui Song; Hongmei Qin; Shiyu Qin; Yibo Zhang; Wenlai Xia; Chuanxi Xiong; Feihua Liu
• Keywords: Interlocking

Abstract High temperature dielectric polymers are the favored materials for energy storage devices under harsh‐environment, e.g., electronic and power systems. It is widely acknowledged that capabilities of markedly deteriorated at elevated because exponential increased leakage current. Herein, all‐organic polymer alloys with two‐phase continuous hard‐soft structure have been firstly investigated via blending high glass transition ( T g ) fluorinated polyimide (FPI) bandgap aliphatic (API). The large band difference between FPI API conducive to trap greatly inhibits conduction loss. In addition, hard soft molecular chains interlocking structures more closely arranged, bringing torturous pathways charge carriers reducing free volume, which enhances breakdown strength. FPI/API alloy (296 °C) concurrent delivers an ultrahigh discharge density 6.6 J cm −3 150 °C 3.02 200 90% efficiency, significantly surpassing those reported dielectrics. Moreover, exhibits remarkable cyclability stability up 10000 charge‐discharge cycles even temperatures. This work provides unprecedented opportunity on design achieve high‐temperature capacitors.