Ultrafast Transfer of Metal‐Enhanced Carbon Nanotubes at Low Temperature for Large‐Scale Electronics Assembly

• DOI: 10.1002/adma.201002415
• Publication Date: 2010-10-12T13:05:13Z
• Authors: Yifeng Fu; Yiheng Qin; Teng Wang; Si Chen; Johan Liu
• Keywords: Cold Temperature; Electricity; Metals; Nanotubes, Carbon; 02 engineering and technology; Electronics; Shear Strength; 0210 nano-technology; Indium

An indium-assisted ultrafast carbon nanotube (CNT) transfer method with a yield rate over 90% is described. Metal-coated as-transferred CNT structures exhibit excellent electrical performance that at least one order of magnitude better than the previously published results. Shear test results show adhesion between CNTs and substrate greatly improved flexibility obtained after process.