Direct Laser Writing: From Materials Synthesis and Conversion to Electronic Device Processing
Materials processing
Electronic materials
DOI:
10.1002/adma.202402014
Publication Date:
2024-03-29T09:29:55Z
AUTHORS (9)
ABSTRACT
Direct Laser Writing (DLW) has been increasingly selected as a microfabrication route for efficient, cost-effective, high-resolution material synthesis and conversion. Concurrently, lasers participate in the patterning assembly of functional geometries several fields application, which electronics stand out. In this review, recent advances strategies based on DLW are surveyed outlined, laser growth strategies. First, main parameters influencing transformation mechanisms summarized, aimed at selective, tailored writing conductive semiconducting materials. Additive transformative processing discussed, to open space explore categories materials directly synthesized or transformed microfabrication. These include metallic conductors, metal oxides, transition chalcogenides carbides, laser-induced graphene, their mixtures. By accessing wide range types, DLW-based electronic applications explored, including components, energy harvesting storage, sensing, bioelectronics. The expanded capability multiple fabrication steps different implementation levels, from engineering device processing, indicates future applicability next-generation electronics, where more accessible, green approaches integrate comprehensive tools.
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