Inhibition Role of Trace Metal Ion Additives on Zinc Dendrites during Plating and Striping Processes

• DOI: 10.1002/admi.201901358
• Publication Date: 2019-11-11T08:55:23Z
• Authors: Ge Chang; Shijun Liu; Yanan Fu; Xin Hao; Wei Jin; Xiaobo Ji; Jiugang Hu
• Keywords: 02 engineering and technology; 0210 nano-technology

Abstract Dendritic inhibition is crucial for the cycle and reversibility of zinc‐based batteries. In this work, trace metal ions including lead, copper, nickel are used as additives to inhibit growth zinc dendrites. The interfacial evolution behaviors deposits during plating striping processes in situ observed by synchrotron radiation X‐ray imaging technique. addition lead induces a polarization role reduction, whereas copper present depolarization role. After adding or ions, become smoother dendrites effectively suppressed because homogenous deposition sites induced co‐deposition nickel. Due large number bubbles generate on substrate loose adhere bubble surface. addition, presence more homogeneous stripping behavior. These results helpful understanding potentially improve