A New Printed Electronics Approach Eliminating Redundant Fabrication Process of Vertical Interconnect Accesses: Building Multilayered Circuits in Porous Materials

• DOI: 10.1002/admt.201700346
• Publication Date: 2018-02-08T10:30:45Z
• Authors: Tengyuan Zhang; Eaton Asher; Jun Yang
• Keywords: Printed Electronics; Flexible Electronics

Abstract Printed electronics are striving for smaller size, increased functionality, and lower energy consumption, which impose critical demand multilayered printed circuits. As a low‐cost green substrate, cellulose paper has become the most attractive choice printing of sustainable disposable electronics. However, redundant processes drilling holes and/or depositing dielectric materials, when fabricating vertical interconnect access (VIA) these circuits, greatly increase cost. In this paper, simple, cost‐effective, scalable method is proposed high‐performance, paper‐based circuits contain highly conductive VIAs without physically or additional material. Taking advantages inkjet electroless copper deposition, metallization depth substrate can be controlled with ease. method, porous structure previously an obstacle to electronics, becomes advantage by triggering 3D resulting in ultralow sheet resistance ≈4.8 mΩ sq −1 single layer traces ≈2.6 VIAs. A functional double‐layered battery‐free device drill‐less VIA, featuring harvesting function, fabricated using on first time.