Unleashing the Performance of Self‐Rolled‐Up 3D Inductors via Deterministic Electroplating on Cylindrical Surfaces (Adv. Mater. Technol. 10/2024)

DOI: 10.1002/admt.202470043 Publication Date: 2024-05-22T07:31:09Z
ABSTRACT
Electroplating In article number 2400092, Xiuling Li and co-workers introduce a strain-induced self-rolled-up membrane (S-RuM) platform that presents CMOS-compatible solution for extreme miniaturization on-chip integration of passive components including inductors capacitors. By employing post-rolling electroplating on both the walls core curved surfaces S-RuM inductor arrays, enhancements to quality factor inductance can be achieved without sacrificing footprint.
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