Synthesis and properties of trifluoromethyl groups containing epoxy resins cured with amine for low Dk materials

• DOI: 10.1002/app.35300
• Publication Date: 2011-11-02T19:50:59Z
• Authors: J. Y. Wang; S.Y. Yang; Y.L. Huang; H.W. Tien; W.K. Chin; C.C.M. Ma; W.J. Shu
• Keywords: Diglycidyl ether

Abstract The study synthesized a trifluoromethyl (CF 3 ) groups with modified epoxy resin, diglycidyl ether of bisphenol F (DGEBF), using environmental friendly methods. resin was cured 4,4′‐diaminodiphenyl‐methane (DDM). For comparison, this also investigated curing commercially available A (DGEBA) the same agent by varying ratios DGEBF. structure and physical properties resins were characterized to investigate effect injecting fluorinated into structures. Regarding thermal behaviors specimens, glass transition temperatures ( T g 50–160°C decomposition 200–350 °C at 5% weight loss d in nitrogen decreased as amount DGEBF increased. different showed reduced dielectric constants D k (2.03–3.80 1 MHz) that lower than those pure DGEBA resins. Reduced constant is related high electrronegativity large free volume fluorine atoms. In presence hydrophobic CF groups, exhibited low moisture absorption higher contact angles. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012