Low‐dielectric constant and viscosity tetrafunctional bio‐based epoxy resin containing cyclic siloxane blocks

• DOI: 10.1002/app.52176
• Publication Date: 2022-02-01T15:29:54Z
• Authors: Pengbo Zhang; Tongjie Yao; Kangle Xue; Xianbin Meng; Junying Zhang; Li Liu
• Keywords: Siloxane

Abstract Bio‐based epoxy resins with low‐dielectric constant, low viscosity and excellent mechanical properties have great significance for the future of advanced electronic microelectronic industries. Cyclosiloxane segment possesses polarity, high‐dissociation energy, elevated molecular volume, thereby making it useful synthesis materials dielectric constant viscosity. Herein, a tetrafunctional eugenol‐based resin (DEP) based on cyclosiloxane structure was designed prepared through hydrosilylation reaction. Allyl glycidyl ether (AGE) selected as reference compound generated silylation (AGDEP). The these silicone‐containing monomers (< 0.315 Pa·s) significantly lower than that conventional oil‐based (14.320 Pa·s). After curing methyl hexahydrophthalic anhydride (MHHPA), DEP‐MHHPA 2.8 (10 MHz), which superior to EP‐MHHPA. Notably, glass transition temperature ( T g ) high 100.3°C. tensile strength elongation at break were estimated be 66.1 MPa 6.0%, respectively. Multifunctional provide an efficient guideline building epoxy‐based better design future‐oriented engineering materials.