Metal–Organic Frameworks: New Interlayer Dielectric Materials

• DOI: 10.1002/celc.201402456
• Publication Date: 2015-02-20T19:38:39Z
• Authors: Muhammad Usman; Shruti Mendiratta; Kuang‐Lieh Lu
• Keywords: Microelectronics; Leakage (economics); High-κ dielectric

Abstract Some metal–organic frameworks (MOFs) with low dielectric constants, high thermal/mechanical stabilities, leakage currents, and good comparability in devices can lead to integrated circuits, which the MOF act as an interlayer (ILD) material tunable structural properties porosity. Based on initial research, this Highlight, we propose a roadmap that serve starting point for addressing potential use of MOFs ILD materials microelectronics industry, providing effective path towards achieving remarkable new applications future.