Investigation of high‐entropy alloy derived spinel‐based layer for SOFC cathode‐side contact application

• DOI: 10.1002/fuce.202300117
• Publication Date: 2024-01-08T03:15:20Z
• Authors: Yutian Yu; Youchen Lin; Ruizhu Li; Jingxuan Hao; Yue Lu; Chengzhi Guan; Guoping Xiao; Jian‐Qiang Wang
• Keywords: Contact resistance; Isothermal process

Abstract A simulated interconnect/contact/cathode/cathode support test cell is fabricated to investigate the effectiveness of high‐entropy alloy as contact material on microstructure and performance converted spinel‐based layer. Although CuMnNiFeCo powder selected precursor, it showed good sinterability after sintering at 900°C for 2 h in air. The electrical layer evaluated by area‐specific resistance measurement, including isothermal exposure thermal cycling. compatibility with adjacent components investigated through observing cross‐sectional view cell. Furthermore, inhibiting Cr migration also assessed.