Enhanced thermal conductivity of epoxy composites by constructing thermal conduction networks via adding hybrid alumina filler

• DOI: 10.1002/pc.26392
• Publication Date: 2021-11-10T18:23:12Z
• Authors: Zhong‐Yu Wang; Xiao‐Nan Zhou; Zi‐Xuan Li; Song‐Song Xu; Liu‐Cheng Hao; Jun‐Ping Zhao; Bo Wang; Jian‐Feng Yang; Kozo Ishizaki
• Keywords: Filler (materials); Particle (ecology); Mass fraction

Abstract High thermal conductivity of polymer composites could be achieved through constructing 3D continuous thermally conductive networks into composites. Herein, we demonstrate a simple, effective method to optimize the segregated alumina by using ternary mixture particles with different diameter ratios (5.8 μm + 2.6 0.5 μm) at fixed total content 60 wt% via conventional melt blending method. The properties epoxy were investigated as function weight fraction and particle size particles. (TC) values coarse fillers (13.2 are in agreement Agari model high filler loading (57 ~ 67 wt%). And value C 2 was ~0.949 (close 1), indicating that formation heat conduction paths addition smaller (2.6 facilitates higher interaction degree between polymer/fillers, consequently, leads T g 147.8°C. A TC 1.109 W m −1 K is ratio sizes 7/2/1, corresponding enhancement 23%–32% compared single filler. suitable proportion hybrid crucial for three‐dimension network, which nano‐particles filled micro‐particles increase particle‐to‐particle connectivity.