Micro‐/Nanohierarchical Surfaces for Enhanced Pool Boiling in Large‐Area Silicon Multichips

• DOI: 10.1002/sstr.202400512
• Publication Date: 2025-01-28T08:06:12Z
• Authors: Youngseob Lee; Kiwan Kim; Yunseo Kim; Daeyoung Kong; Jeonghwan Park; Daehyuk Son; Sungchan Kang; Seogwoo Hong; Hyoungsoon Lee

With the rising demand for data centers, need an efficient thermal management approach becomes increasingly critical. This study examines enhancement in pool boiling heat transfer on a customized multichip module, designed to mimic artificial intelligence chip layouts high‐performance computing. Experiments are conducted smooth surfaces and hierarchical structures integrating micropillars porous copper, specifically copper inverse opal (CuIO) nanowire (NW). The results demonstrate significant enhancements critical flux (CHF) coefficient (HTC) through these structures. Notably, NW‐CuIO‐integrated structure exhibits highest CHF (234 W cm −2 ), achieving 166% over silicon. HTC is more pronounced CuIO‐integrated structure; this achieves of 70.3 kW m K −1 , which represents improvement. heater layout, engineered surfaces, their synergistic effects analyzed visualization. observed inversion phenomena further underscore importance sequential activation nucleation sites improving performance. provides valuable insights into mechanisms governing offers practical guidance developing solutions centers.