Wafer-level fabrication process for fully encapsulated micro-supercapacitors with high specific energy

• DOI: 10.1007/s00542-011-1415-7
• Publication Date: 2012-01-06T23:49:11Z
• Authors: Hugo Durou; David Pech; David Colin; Patrice Simon; Pierre-Louis Taberna; Magali Brunet
• Keywords: [CHIM.MATE] Chemical Sciences/Material chemistry; Matériaux; Micro-supercapacitors; Wafer-level; [CHIM.MATE]Chemical Sciences/Material chemistry; 02 engineering and technology; [SPI.MAT] Engineering Sciences [physics]/Materials; 0210 nano-technology; 01 natural sciences; 7. Clean energy; [SPI.MAT]Engineering Sciences [physics]/Materials; 0104 chemical sciences

In this paper a wafer-level process is proposed to fully integrate carbon-based micro-supercapacitor onto silicon substrate. This process relies on the deposition of a paste containing carbon, PVDF and acetone into cavities etched in silicon. After electrolyte deposition in a controlled atmosphere, a wafer-level encapsulation is realized. Cyclic voltammetry performed on non-encapsulated micro-components showed specific energy of 257 mJ cm−2 for 336 μm deep cavities. The specific encapsulation process developed was tested separately and proved to be efficient in terms of resistance to organic electrolytes and mechanical strength.