Genome-wide characterization of DcHsp90 gene family in carnation (Dianthus caryophyllus L.) and functional analysis of DcHsp90-6 in heat tolerance

• DOI: 10.1007/s00709-022-01815-5
• Publication Date: 2022-10-20T15:10:14Z
• Authors: Pengcheng Xue; Yuying Sun; Diandian Hu; Junwei Zhang; Xueli Wan
• Keywords: Thermotolerance; 0301 basic medicine; 0303 health sciences; 03 medical and health sciences; Dianthus; Gene Expression Regulation, Plant; Syzygium; Arabidopsis; Plants, Genetically Modified; Phylogeny; Heat-Shock Response; Plant Proteins

Plant heat shock protein 90 (Hsp90) participates in various physiological processes including protein folding, degradation, and signal transduction. However, the DcHsp90 gene family in carnation (Dianthus caryophyllus L.) has not been systematically analyzed. We thoroughly examined and comprehensively analyzed the carnation DcHsp90 gene family in this study and discovered 9 DcHsp90 genes. Based on the phylogenetic examination, DcHsp90 proteins may be divided into two groups. DcHsp90 structural features were similar but varied between groups. Promoter analysis revealed the presence of many cis-acting elements, most of which were connected to growth and development, hormones, and stress. DcHsp90 genes may play distinct functions in heat stress response, according to gene expression analyses. The DcHsp90-6 was isolated, and its role in the reaction to heat stress was studied. Thermotolerance and superoxide dismutase activity in transgenic seedlings were enhanced by Arabidopsis overexpression of DcHsp90-6. After heat stress, transgenic plants' electrolyte leakage and malondialdehyde levels were much lower than wild-type plants. Furthermore, overexpression of DcHsp90-6 altered the expressions of stress-responsive genes such as AtHsp101, AtHsp90, AtGolS1, AtRS4/5, and AtHsfB1. This study provides comprehensive information on the DcHsp90 gene family and suggests that overexpressed DcHsp90-6 positively regulates thermotolerance highlighting the adaptation mechanism of carnation under heat stress.