Mechanics of nonbuckling interconnects with prestrain for stretchable electronics

• DOI: 10.1007/s10483-021-2715-7
• Publication Date: 2021-04-16T02:02:47Z
• Authors: Zixuan Lu; Liang Quo; Hongyu Zhao
• Keywords: Stretchable electronics; Flexible Electronics; Ribbon; Bar (unit)

Abstract The performance of the flexibility and stretchability flexible electronics depends on mechanical structure design, for which a great progress has been made in past years. use prestrain substrate, causing compression transferred interconnects, can provide high elastic stretchability. Recently, nonbuckling interconnects have designed, where thick bar replaces thin ribbon layout to yield scissor-like in-plane deformation instead in- or out-of-plane buckling modes. interconnect design achieves significantly enhanced However, combined not explored. This paper aims study behavior bonded prestrained substrate analytically numerically. It is found that larger prestrain, longer straight segment, smaller arc radius strain interconnects. On other hand, also cause after releasing prestrain. Therefore, optimization needs be achieve favorable