Heat Transfer Characteristics of Billet/Die Interface and Measures to Relieve Thermal Stress for Hot Forging Die

• DOI: 10.1007/s10765-017-2242-6
• Publication Date: 2017-05-10T06:06:35Z
• Authors: Baoshan Lu; Leigang Wang; Zhe Geng; Yao Huang
• Keywords: Temperature Gradient

The interfacial heat transfer coefficient (IHTC) shows the heat transfer capacity at the billet/die interface during the hot forming process, which affects the temperature gradient in the die that may potentially induce high thermal stress. Consequently, this determines the service life of the die. In this paper, a set of experimental equipments were used to identify the IHTC and the upsetting test of superalloy Inconel718 (GH4169) was carried out on the hot flat die to evaluate the IHTC characteristics after the billet heating and die preheating temperature, holding time, and billet deformation rate. The results indicated that the billet heating temperature has a minimal role in IHTC but the other components have a great impact on IHTC. Among them, the billet deformation rate has influenced the IHTC the most. In the die preheating temperature ranging from $$150\,^{\circ }\hbox {C}~\hbox {to}~400\,^{\circ }\hbox {C}$$ , it was found that the preheating temperature was proportional to IHTC. A high preheating temperature that leads to a high IHTC was found unfavorable in relieving the die surface thermal stress, and also weakened the die hardness and strength. The IHTC declined with the increase in the holding time as a result of the billet oxidation. Based on these findings, the composite ceramic and polymetallic heat-resistant coatings on the die surface were prepared, respectively, to relieve the thermal stress of die surface by reducing IHTC. It showed that both of the treated dies could effectively reduce the IHTC, blocking the transferred heat from the hot billet and making it applicable to the different hot forging events.