Enhanced mechanical, thermal and dielectric properties of polyimide nanocomposites containing SiCp (SiCw) nanofillers for high energy-storage applications

• DOI: 10.1007/s10965-022-03297-8
• Publication Date: 2022-10-01T11:02:41Z
• Authors: Zhao Xin Zhang; Shang Ke Yang; Jun Wei Shen; Jia Yang; Jun Bian; Ai Ping Zhang; Hai Lan Lin; Dai Qiang Chen
• Keywords: 02 engineering and technology; 0210 nano-technology