Electrochemical adsorption properties and inhibition of copper corrosion in chloride solutions by ascorbic acid: experimental and theoretical investigation

• DOI: 10.1007/s11581-013-0902-5
• Publication Date: 2013-04-21T20:37:12Z
• Authors: Güray Kılınççeker; Sema Çelik
• Keywords: Corrosion; 02 engineering and technology; Adsorption isotherm; Electrochemical techniques; 0210 nano-technology; Copper

In this study, the effect of ascorbic acid in the electrochemical behavior of copper has been investigated in 3.5 % NaCl solution using potentiodynamic polarization and electrochemical impedance spectroscopy. Current-potential curve and Nyquist diagrams were obtained in different concentrations of ascorbic acid. The surface morphology of copper after its exposure to 3.5 % NaCl solution with and without of ascorbic acid was examined by scanning electron microscopy. The obtained results show that ascorbic acid inhibits corrosion of copper in 3.5 % NaCl solution. The inhibition activity of ascorbic acid increases with a decrease in the concentration of ascorbic acid.