Chemical Vapor Deposition of Silicon Carbide Epitaxial Films and Their Defect Characterization

• DOI: 10.1007/s11664-006-0084-2
• Publication Date: 2007-04-02T19:41:37Z
• Authors: Govindhan Dhanaraj; Yi Chen; Hui Chen; Dang Cai; Hui Zhang; Michael Dudley
• Keywords: 0103 physical sciences; 01 natural sciences

A chemical vapor deposition (CVD) system was designed and fabricated in our laboratory and SiC homo-epitaxial layers were grown in the CVD process using silicon tetrachloride and propane precursors with hydrogen as a carrier gas. The temperature field was generated using numerical modeling. Gas flow rates, temperature field, and the gradients are found to influence the growth rates of the epitaxial layers. Growth rates were found to increase as the temperature increased at high carrier gas flow rate, while at lower carrier gas flow rate, growth rates were observed to decrease as the temperature increased. Based on the equilibrium model, “thermodynamically controlled growth” accounts for the growth rate reduction. The grown epitaxial layers were characterized using various techniques. Reduction in the threading screw dislocation (SD) density in the epilayers was observed. Suitable models were developed for explaining the reduction in the SD density as well as the conversion of basal plane dislocations (BPDs) into threading edge dislocations (TEDs).