Mitigative Tin Whisker Growth Under Mechanically Applied Tensile Stress

• DOI: 10.1007/s11664-008-0619-9
• Publication Date: 2009-01-05T19:41:06Z
• Authors: Yu-jen Chen; Chih-ming Chen
• Keywords: Hillock; Monocrystalline whisker

Sn whisker/hillock growth is a result of the release of compressive stress in a Sn thin film. Filamentary Sn whiskers were formed on an electrodeposited Sn thin film aged at room temperature, while Sn hillocks were formed as the aging temperature was raised to 80°C and 150°C. By mechanically applying a tensile stress on the Sn thin film, the growth of the Sn whisker/hillock was significantly mitigated. This mitigation growth suggests that part of the compressive stress in the Sn thin film was neutralized by the mechanically applied tensile stress.