Microstructures and fatigue life of SnAgCu solder joints bearing Nano-Al particles in QFP devices

Thermal fatigue Temperature cycling Solder paste
DOI: 10.1007/s13391-014-3190-y Publication Date: 2014-05-08T18:45:46Z
ABSTRACT
Microstructures and fatigue life of SnAgCu and SnAgCu bearing nano-Al particles in QFP (Quad flat package) devices were investigated, respectively. Results show that the addition of nano-Al particles into SnAgCu solder can refine the microstructures of matrix microstructure. Moreover, the nano-Al particles present in the solder matrix, act as obstacles which can create a back stress, resisting the motion of dislocations. In QFP device, it is found that the addition of nano-Al particles can increase the fatigue life by 32% compared with the SnAgCu solder joints during thermal cycling loading.
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