Microstructures and fatigue life of SnAgCu solder joints bearing Nano-Al particles in QFP devices

• DOI: 10.1007/s13391-014-3190-y
• Publication Date: 2014-05-08T18:45:46Z
• Authors: Liang Zhang; Xi-ying Fan; Yong-huan Guo; Cheng-wen He
• Keywords: Thermal fatigue; Temperature cycling; Solder paste

Microstructures and fatigue life of SnAgCu and SnAgCu bearing nano-Al particles in QFP (Quad flat package) devices were investigated, respectively. Results show that the addition of nano-Al particles into SnAgCu solder can refine the microstructures of matrix microstructure. Moreover, the nano-Al particles present in the solder matrix, act as obstacles which can create a back stress, resisting the motion of dislocations. In QFP device, it is found that the addition of nano-Al particles can increase the fatigue life by 32% compared with the SnAgCu solder joints during thermal cycling loading.