An investigation into flow and heat transfer of an ultrasonic micro-blower device for electronics cooling applications

• DOI: 10.1016/j.applthermaleng.2016.06.094
• Publication Date: 2016-06-20T10:51:11Z
• Authors: Omidreza Ghaffari; Stephen A. Solovitz; Muhammad Ikhlaq; Mehmet Arik
• Keywords: Heat transfer enhancement

Abstract As compact electronics increase in functionality, new electronics cooling approaches must be more effective, and they must be lower in form factor. In this paper, we investigated the cooling performance of a miniature ultrasonic micro-blower impinging upon a vertical heater. We studied the temperature response at different operating conditions, determining the optimal thermal conditions. We further examined the local flow field using the particle image velocimetry (PIV) technique at the same operating conditions, providing explanations for the heat transfer response in terms of the fluid dynamics. Heat transfer measurements show that the maximum cooling performance occurs at a jet-to-surface spacing ratio of 15