A combined solution of thermoelectric coolers and microchannels for multi-chip heat dissipation with precise temperature uniformity control

• DOI: 10.1016/j.applthermaleng.2022.119370
• Publication Date: 2022-09-30T06:24:16Z
• Authors: Bo Cong; Yanmei Kong; Yuxin Ye; Ruiwen Liu; Xiangbin Du; Lihang Yu; Shiqi Jia; Zhiguo Qu; Binbin Jiao
• Keywords: 0103 physical sciences; 0202 electrical engineering, electronic engineering, information engineering; 02 engineering and technology; 01 natural sciences