Unusual pattern formation on Si(100) due to low energy ion bombardment

Condensed Matter - Materials Science Condensed Matter - Mesoscale and Nanoscale Physics Mesoscale and Nanoscale Physics (cond-mat.mes-hall) Materials Science (cond-mat.mtrl-sci) FOS: Physical sciences 02 engineering and technology 0210 nano-technology
DOI: 10.1016/j.apsusc.2012.06.054 Publication Date: 2012-07-02T05:03:19Z
ABSTRACT
17 pages, 5 figures<br/>In this paper evolution of silicon surface topography, under low energy ion bombardment, is investigated at higher oblique incident angles in the range of 63\degree-83\degree. Si(100) substrates were exposed to 500 eV argon ions. Different surface morphology evolves with increasing angle of incidence. Parallel-mode ripples are observed up to 67\degree which undergo a transition to perpendicular-mode ripples at 80\degree. However, this transition is not a sharp one but undergoes a series of unusual pattern formation at intermediate angles. Complete smoothening of silicon surface is observed at incident angles beyond 80\degree. The observed patterns are attributed to surface confined viscous flow and sputter erosion under ion bombardment.<br/>
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