Optimum inductively coupled plasma etching of fused silica to remove subsurface damage layer

• DOI: 10.1016/j.apsusc.2015.07.168
• Publication Date: 2015-07-26T15:13:25Z
• Authors: Xiaolong Jiang; Ying Liu; Zhengkun Liu; Keqiang Qiu; Xiangdong Xu; Yilin Hong; Shaojun Fu
• Keywords: Plasma Etching; Dry etching

Abstract In this work, we introduce an optimum ICP etching technique that successfully removes the subsurface damage (SSD) layer of fused silica without causing plasma induced surface damage (PISD) or lateral etching of SSD. As one of the commonest PISD initiators, metal contamination from reactor chamber is prevented by employing a simple isolation device. Based on this device, a unique low-density pitting damage is discovered and subsequently eliminated by optimizing the etching parameters. Meanwhile etching anisotropy also improves a lot, thus preventing the lateral etching of SSD. Using this proposed technique, SSD layer of fused silica is successfully removed with a surface roughness of 0.23 nm.