Effects of Sn, Gd, and Mn additions on the surface chemistry and electrochemical behavior of CuAl-based alloys in sodium chloride solution

• DOI: 10.1016/j.apsusc.2021.151488
• Publication Date: 2021-10-11T19:24:45Z
• Authors: Juliana Sarango d...; Mara Cristina Lop...; Renato Altobelli ...; Ricardo Alexandre...
• Keywords: 0205 materials engineering; 02 engineering and technology

Abstract In the present work, the effects of Gd, Mn, and Sn additions on the surface chemistry and the electrochemical behavior of CuAl-based shape memory alloys were studied. Alloys were produced by arc furnace melting. The corrosion behavior was evaluated by electrochemical impedance spectroscopy (EIS) in 3.5 wt% NaCl solution up to 24 h of immersion. The surface chemical states were assessed by X-ray photoelectron spectroscopy (XPS). Correlation between the corrosion behavior and the surface chemistry is discussed. Gd addition increased the corrosion resistance of the CuAl-base alloy. Mn and Sn additions led to the formation of non-protective oxide films.