Copper-incorporated dendritic mesoporous silica nanospheres and enhanced chemical mechanical polishing (CMP) performance via Cu2+/H2O2 heterogeneous Fenton-like system

• DOI: 10.1016/j.apsusc.2022.154262
• Publication Date: 2022-07-16T07:24:34Z
• Authors: Yang Chen; Aoli Wei; Xiangyu Ma; Wang Tianyu; Ailian Chen
• Keywords: 02 engineering and technology; 0210 nano-technology