Copper-incorporated dendritic mesoporous silica nanospheres and enhanced chemical mechanical polishing (CMP) performance via Cu2+/H2O2 heterogeneous Fenton-like system
Chemical Mechanical Planarization
DOI:
10.1016/j.apsusc.2022.154262
Publication Date:
2022-07-16T07:24:34Z
AUTHORS (5)
ABSTRACT
SUPPLEMENTAL MATERIAL
Coming soon ....
REFERENCES (71)
CITATIONS (22)
EXTERNAL LINKS
PlumX Metrics
RECOMMENDATIONS
FAIR ASSESSMENT
Coming soon ....
JUPYTER LAB
Coming soon ....