Low-temperature Cu/SiO2 hybrid bonding based on Ar/H2 plasma and citric acid cooperative activation for multi-functional chip integration
DOI:
10.1016/j.apsusc.2023.159074
Publication Date:
2023-12-02T23:39:09Z
AUTHORS (7)
ABSTRACT
SUPPLEMENTAL MATERIAL
Coming soon ....
REFERENCES (56)
CITATIONS (21)
EXTERNAL LINKS
PlumX Metrics
RECOMMENDATIONS
FAIR ASSESSMENT
Coming soon ....
JUPYTER LAB
Coming soon ....