A new solder matrix nano polymer composite for thermal management applications

• DOI: 10.1016/j.compscitech.2014.01.015
• Publication Date: 2014-01-29T10:31:45Z
• Authors: Carl Zandén; Xin Luo; Lilei Ye; Johan Liu
• Keywords: Temperature cycling; Microelectronics

The increasing integration of microelectronics, raising the need for effective heat dissipation, requires new and improved composite materials technologies. For both thermal interface and die attach materials, a major challenge is to combine low thermal resistance joints with sufficient thermomechanical decoupling and reliability. In this paper, we present the fabrication and characterisation of a new type of solder matrix nano polymer composite (SMNPC) aiming to address these challenges. The SMNPC is fabricated into preforms by liquid-phase infiltration of a Sn–Ag–Cu matrix into a silver nanoparticle coated electrospun polyimide fibre mesh. The composite is demonstrated to possess high heat transfer capability, close to that of a direct soldered interface, lower elastic modulus compared to pure Sn–Ag–Cu alloy, and reliable thermomechanical performance during thermal cycling. Taken together, the results indicate that the developed SMNPC can be a useful composite alternative compared to conventional solders and polymer matrix materials for thermal management applications.