Comparative study on corrosion behavior of Cu and Sn under UV light illumination in chloride-containing borate buffer solution

Passivation Buffer solution Buffer (optical fiber) Tin oxide Pitting Corrosion
DOI: 10.1016/j.corsci.2021.109471 Publication Date: 2021-04-16T02:09:52Z
ABSTRACT
Abstract Corrosion behaviors of copper and tin in chloride-containing borate buffer solutions (pH 8.4) were investigated through electrochemical and spectroscopic techniques in the presence and absence of UV illumination. Concerning effects of UV light on the corrosion processes, in a borate buffer solution containing 0.025 M NaCl, photo-enhanced pitting corrosion was observed on copper while photo-induced passivation was found on tin. The effect of UV illumination on corrosion was dependent on the interaction between the photo-generated carriers and the metal oxides, as well as the photostability of the oxide film. Chloride anions can decrease the photostability of the oxide film.
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