Numerical case study and modeling for spreading thermal resistance and effective thermal conductivity for flat heat pipe

• DOI: 10.1016/j.csite.2022.101803
• Publication Date: 2022-01-15T16:41:09Z
• Authors: Myeongjin Kim; Kyun Ho Lee; Dong In Han; Joo Hyun Moon
• Keywords: Thermal effusivity; Thermal transmittance

Flat heat pipe, vapor chamber, thermal ground plane, and spreader have been emerging topics for various applications such as electric battery packs high-power computer chips. In this study, computational fluid dynamics is used to model the effective conductivity of a chamber plane. From literature, simulation conditions are obtained different flat pipe geometries. With commercial code Fluent (Ansys Inc.), 4,800 cases examine spreading resistance tendencies sink areas, source area, thickness, transfer coefficient. conclusion, increases when thickness decreases or area becomes greater with same value. particular, modified proposed better accuracy targeting conductivity, based on original analytical model. A good agreement found between numerical results. This study will be able provide system guideline pipes.