Embedded cooling method with configurability and replaceability for multi-chip electronic devices

• DOI: 10.1016/j.enconman.2021.115124
• Publication Date: 2021-12-21T10:05:55Z
• Authors: Nan Zhang; Binbin Jiao; Yuxin Ye; Yanmei Kong; Xiangbin Du; Ruiwen Liu; Bo Cong; Lihang Yu; Shiqi Jia; Kunpeng Jia
• Keywords: 0211 other engineering and technologies; 0202 electrical engineering, electronic engineering, information engineering; 02 engineering and technology