Two-stage multichannel liquid–metal cooling system for thermal management of high-heat-flux-density chip array

• DOI: 10.1016/j.enconman.2022.115591
• Publication Date: 2022-04-09T16:07:53Z
• Authors: Yueguang Deng; Manman Zhang; Yi Jiang; Jing Liu
• Keywords: 0202 electrical engineering, electronic engineering, information engineering; 02 engineering and technology