Morphological stability of electrostrictive thin films

• DOI: 10.1016/j.ijengsci.2024.104073
• Publication Date: 2024-04-24T17:08:09Z
• Authors: Jin Zhang; Peter W. Voorhees
• Keywords: Condensed Matter - Materials Science; 0202 electrical engineering, electronic engineering, information engineering; Materials Science (cond-mat.mtrl-sci); FOS: Physical sciences; Physics - Applied Physics; 02 engineering and technology; Mathematical Physics (math-ph); Applied Physics (physics.app-ph); Mathematical Physics

A large electric field is typically present in anodic or passive oxide films. Stresses induced by such a large electric field are critical in understanding the breakdown mechanism of thin oxide films and improving their corrosion resistance. In this work, we consider electromechanical coupling through the electrostrictive effect. A continuum model incorporating lattice misfit and electric field-induced stresses is developed. We perform a linear stability analysis of the full coupled model and show that, for typical oxides, neglecting electrostriction underestimates the film's instability, especially in systems with a large electric field. Moreover, a region where electrostriction can potentially provide a stabilizing effect is identified, allowing electrostriction to enhance corrosion resistance. We identified an equilibrium electric field intrinsic to the system and the corresponding equilibrium film thickness. The film's stability is very sensitive to the electric field: a 40 percent deviation from the equilibrium electric field can change the maximum growth rate by nearly an order of magnitude. Moreover, our model reduces to classical morphological instability models in the limit of misfit-only, electrostatic-only, and no-electrostriction cases. Finally, the effect of various parameters on the film's stability is studied.