Three-dimensional interconnected graphene architecture reinforced epoxy composite with superior mechanical and tribological properties

• DOI: 10.1016/j.jmrt.2023.10.099
• Publication Date: 2023-10-13T06:36:18Z
• Authors: Chunying Min; Zhaolong Sun; Qiuying Li; Hang Yu; Zhiwei Xu; Hongyu Liang
• Keywords: Thermal Stability; Transfer molding

The tribological performances reinforcement is limited by insufficient dispersion and random orientation of nanofillers in composites. In light above difficulties, a three-dimensional (3D) interconnected graphene architecture (3DGA) was designed, which the pre-formed three dimensions. 3DGA reinforced epoxy composite (3DGA/EP) fabricated resin transfer molding combined with in-situ ultrasonic method, assembling from sheets good distribution state, resulted exceptional thermal stability, mechanical properties for Compared oxide (GO)/EP composites direct solution blending, glass transition temperature tensile strength 3DGA/EP increased 27.1 °C 41.1%, wear rate decreased 38.1%, respectively. this work, utilized as ordered instead two-dimensional sheets, providing promising strategy to achieve high-performance polymer-based superior properties.