Exploring hot deformation behavior of the solutionized Cu–15Ni–8Sn alloy through constitutive equations and processing maps

• DOI: 10.1016/j.jmrt.2024.01.225
• Publication Date: 2024-01-26T13:26:52Z
• Authors: Xuemao Dong; Jing Xu; Zhongxue Feng; Jialiang Dong; Caiju Li; Jianhong Yi
• Keywords: Flow stress; Dynamic Recrystallization; Deformation mechanism; Recrystallization (geology)

The hot deformation behavior of the solutionized Cu–15Ni–8Sn alloy is investigated by compression tests at temperatures 750–900 °C and strain rates 0.001–1.0 s−1. flow stress curves are analyzed, constitutive equations developed to predict alloy. In addition, optimal conditions proposed through constructed processing map microstructure analysis, revealing impact mechanism under different parameters on evolution. results show that temperature rate have a great influence strain-compensated equation can well peak alloy, with correlation coefficient 0.993 between experimental predicted values. high power consumption region mainly caused dynamic recovery partial recrystallization, while localization main reason for appearance unstable region. optimum range 750–780 0.001–0.0025