Interfacial characteristics, interfacial oxide evolution and bonding mechanism of 2219 aluminum alloy joints manufactured by hot-compression bonding

• DOI: 10.1016/j.jmrt.2024.04.080
• Publication Date: 2024-04-11T04:38:08Z
• Authors: Dazhao Xu; Mingxi Jiang; Linggang Meng; Mengqi Zhu; Yunfeng Liu; Xingguo Zhang
• Keywords: Thermocompression bonding; Aluminum Oxide; Anodic bonding

The bonding joints of 2219 aluminum alloy with different deformations 30%, 45% and 55% were fabricated using hot-compression bonding, subsequent subjected to homogenization treatment. interfacial microstructure oxide evolution the systematically investigated. results showed that increasing deformation can effectively reduce formation voids promote grain boundary migration (IGBM). As increased from 30% 55%, flat interface transformed into curved boundaries, ultimately being occupied by dynamically recrystallized (DRXed) grains. development IGBM DRXed grains is crucial for ensuring high-quality joints. At deformation, strength reached 156.2 MPa, corresponding 98.1% matrix strength. In addition, residual film Al2O3 reacted MgO MgAl2O4 spinel. final products at mixture MgO, Al2Cu, Al2O3, MgAl2O4. successfully achieved relatively clean atomic after homogenization. Based on void closure, fragmentation evolution, recrystallization, mechanism was proposed. These findings contribute our understanding process in metal solid bonding.