Interfacial characteristics, interfacial oxide evolution and bonding mechanism of 2219 aluminum alloy joints manufactured by hot-compression bonding

• DOI: 10.1016/j.jmrt.2024.04.080
• Publication Date: 2024-04-11T04:38:08Z
• Authors: Dazhao Xu; Mingxi Jiang; Linggang Meng; Mengqi Zhu; Yunfeng Liu; Xingguo Zhang
• Keywords: Bonding mechanism; Mining engineering. Metallurgy; 0203 mechanical engineering; 2219 aluminum alloy; Hot-compression bonding; TN1-997; Dynamic recrystallization; Interfacial oxide; 0210 nano-technology

The bonding joints of 2219 aluminum alloy with different deformations of 30%, 45% and 55% were fabricated using hot-compression bonding, and subsequent subjected to homogenization treatment. The interfacial microstructure and interfacial oxide evolution of the bonding joints were systematically investigated. The results showed that increasing deformation can effectively reduce the formation of interfacial voids and promote the interfacial grain boundary migration (IGBM). As the deformation increased from 30% to 55%, the flat bonding interface transformed into curved grain boundaries, and ultimately being occupied by dynamically recrystallized (DRXed) grains. The development of IGBM and interfacial DRXed grains is crucial for ensuring high-quality bonding joints. At 55% deformation, the interface bonding strength reached 156.2 MPa, corresponding to 98.1% of the matrix bonding strength. In addition, the residual interfacial oxide film Al2O3 reacted with MgO and transformed into MgAl2O4 spinel. The final evolution products at the bonding interface were the mixture of MgO, Al2Cu, Al2O3, and MgAl2O4. The bonding interface at 55% deformation successfully achieved relatively clean atomic bonding after homogenization. Based on interfacial void closure, interfacial oxide film fragmentation and evolution, and interfacial recrystallization, the bonding mechanism of 2219 aluminum alloy joints was proposed. These findings contribute to our understanding of the interfacial bonding process in metal solid bonding.