Amorphous interlayer assisted ductility of Mo-Cu alloy

• DOI: 10.1016/j.matdes.2023.112010
• Publication Date: 2023-05-18T01:53:27Z
• Authors: Tianyu Liu; Xingwei Liu; Jin Cao; Xinya Feng; Shukui Li; Jinxu Liu
• Keywords: Ductility (Earth science)

Generally, binary immiscible alloys have poor plasticity due to weak interfacial bonding. In this study, an amorphous interlayer was introduced between Mo and Cu phases in Mo-Cu by using the high-temperature infiltration method. With increase of infiltrated temperature from 1300 °C 1450 °C, thickness wad increased 2 nm 13 nm. The formation process, thermodynamic driving force, stability alloy, its contribution mechanical properties were systematically investigated. By "macroscopic atom approach" Miedema's model, force proved. It found that thickening can significantly improve bonding, thus leading tensile strength alloy 520 600 MPa failure strain 0.15 0.31 deformation behavior shows effectively absorb dislocations during deformation, relieve stress concentration at interface crystallization, delaying initiation propagation cracks phase boundaries, which broke through limitation trade-off such materials.