Advancing the thermal stability of 3D ICs using logi-thermal simulation

• DOI: 10.1016/j.mejo.2015.06.025
• Publication Date: 2015-08-06T21:49:20Z
• Authors: Gergely Nagy; Péter Horváth; László Pohl; András Poppe
• Keywords: Three-dimensional integrated circuit; Thermal Stability

3D ICs have emerged in the past few years. While they solve a large number of problems related to scaling, also create new ones. Removing heat from layers far cooling facilities is great challenge still under intensive research. This paper shows how logi-thermal simulation can be used predict operation parameters digital systems realized ICs. The method effectively guide place-and-route algorithms and find thermal bottlenecks.