Crack propagation in multilayer thin-film structures of electronic packages using the peridynamic theory

• DOI: 10.1016/j.microrel.2011.05.011
• Publication Date: 2011-07-05T10:44:26Z
• Authors: A. Agwai; I. Guven; E. Madenci
• Keywords: Indentation; Continuum hypothesis; Peridynamics

Abstract This paper presents an application of the peridynamic theory to predict crack paths in multilayer thin-film structures of electronic packages. The peridynamic theory is a nonlocal continuum theory that has an inherent crack initiation and growth criterion. Specifically, the peridynamic theory is employed to model cross-sectional nanoindentation, an experimental technique used for characterizing interfacial adhesion and observing crack paths. Cross-sectional indentation experiments previously conducted on blanket and patterned thin-film structures were simulated. The predicted crack propagation paths in both blanket and patterned multilayer thin-film structures compare well with the results from cross-sectional nanoindentation experiments.