Fabrication and characterization of microscale heat sinks

• DOI: 10.1016/j.microrel.2017.05.028
• Publication Date: 2017-06-07T14:45:57Z
• Authors: Gábor Takács; György Bognár; Enikő Bándy; Gábor Rózsás; Péter G. Szabó
• Keywords: 0103 physical sciences; 02 engineering and technology; 0210 nano-technology; 01 natural sciences

In the field of thermal management, engineers are well aware of the challenges posed by the increasing level of dissipation. Among the many possible solutions to counter the threat of overheating, one is dealing with the usage of microscale heat exchangers, where the forced air or liquid cooling solution is integrated into the electronic package itself. As the System-on-Package integration is not a straightforward task, many fabrication steps have to be fully developed before a successful chip-level cooling system is ready to be used. In this paper, as one of these many steps, we present a refined manufacturing technology which gives the possibility to create the microscale heatsink integrated together with the electronic devices. With the refined manufacturing technology several channel patterns can be created easily. Nevertheless, only a simple channel pattern is presented now which is tested with the enhanced thermal characterization method developed for microchannel based cooling structures last year.