Warpage prediction of fan-out wafer-level package based on coupled deep learning and finite element simulation

• DOI: 10.1016/j.microrel.2025.115759
• Publication Date: 2025-04-28T12:42:26Z
• Authors: Xiaohui Zhao; Hao Zheng; Zhiyan Zhao; Mengxuan Cheng; Wenqian Li; Guoshun Wan; Yuxi Jia
• Keywords: Fan-out