Beam test of a 180 nm CMOS Pixel Sensor for the CEPC vertex detector

• DOI: 10.1016/j.nima.2023.168945
• Publication Date: 2023-11-18T04:49:52Z
• Authors: Tianya Wu; Shuqi Li; Wei Wang; Jia Zhou; Ziyue Yan; Yiming Hu; Xiaoxu Zhang; Zhijun Liang; Wei Wei; Ying Zhang; Xiaomin Wei; Xinhui Huang; Lei Zhang; Ming Qi; Hao Zeng; Xuewei Jia; Jun Hu; Jinyu Fu; Hongyu Zhang; Gang Li; Linghui Wu; Mingyi Dong; Xiaoting Li; Raimon Casanova; Liang Zhang; Jianing Dong; Jia Wang; Ran Zheng; Weiguo Lu; Sebastian Grinstein; João Guimarães da...
• Keywords: High Energy Physics - Experiment (hep-ex); Physics - Instrumentation and Detectors; 0103 physical sciences; FOS: Physical sciences; Instrumentation and Detectors (physics.ins-det); 01 natural sciences; High Energy Physics - Experiment

The proposed Circular Electron Positron Collider (CEPC) imposes new challenges for the vertex detector in terms of pixel size and material budget. A Monolithic Active Pixel Sensor (MAPS) prototype called TaichuPix, based on a column drain readout architecture, has been developed to address the need for high spatial resolution. In order to evaluate the performance of the TaichuPix-3 chips, a beam test was carried out at DESY II TB21 in December 2022. Meanwhile, the Data Acquisition (DAQ) for a muti-plane configuration was tested during the beam test. This work presents the characterization of the TaichuPix-3 chips with two different processes, including cluster size, spatial resolution, and detection efficiency. The analysis results indicate the spatial resolution better than 5 $μm$ and the detection efficiency exceeds 99.5 % for both TaichuPix-3 chips with the two different processes.