Laser slicing of 4H-SiC wafers based on picosecond laser-induced micro-explosion via multiphoton processes

• DOI: 10.1016/j.optlastec.2022.108323
• Publication Date: 2022-06-06T22:09:24Z
• Authors: Shifei Han; Haijuan Yu; Chaojian He; Shusen Zhao; Chaoyu Ning; Lu Jiang; Xunchun Lin
• Keywords: 0103 physical sciences; 02 engineering and technology; 0210 nano-technology; 01 natural sciences