Influence of Oxygen Flow Rate on the Variation of Surface Roughness of Fused Silica during Plasma Polishing Process

• DOI: 10.1016/j.phpro.2011.06.067
• Publication Date: 2011-08-08T04:31:01Z
• Authors: Yuan Tian; Weiguo Liu; Lingxia Hang
• Keywords: plasma polishing; fused silica; 0103 physical sciences; capacitive coupled hollow cathode RF discharge; 02 engineering and technology; Super smooth optical surface; Physics and Astronomy(all); 0210 nano-technology; 01 natural sciences; 7. Clean energy; roughness

AbstractA novel capacitive coupled hollow cathode (CCHC) RF vacuum discharge polishing apparatus was established in house. The plasma was generated by using 13.56MHz and 100MHz RF power source respectively. Pre-polished fused silica substrates with average surface roughness of 1.5nm (rms) were used for the investigation of the plasma polishing process. SF6 was used as the active etching gas, Ar and O2 or their mixture was used as carrying gas. The gas flow of SF6 was fixed at 10 SCCM, the total flow rate of the carrying gases was selected as 110 SCCM. When the carrying gas was pure Ar, the surface roughness of the fused silica substrate increased from about 1.5nm to 2.0nm and to 4.1nm for 13.56MHz and 100MHz plasma etching respectively. When the plasma was generated at 13.56MHz, the surface roughness of the fused silica substrate decreased with the increasing of the gas flow rate of O2, and reached its minimum of 1.04nm with an O2 flow rate of 50 SCCM. Similar result was obtained when the plasma was generated at 100MHz, the difference was that the minimum roughness of the substrate was 0.88nm.