Evolution of interfacial dislocation network during anisothermal high-temperature creep of a nickel-based superalloy

• DOI: 10.1016/j.scriptamat.2011.10.022
• Publication Date: 2011-10-24T17:00:54Z
• Authors: M. Hantcherli; F. Pettinari-Sturmel; B. Viguier; J. Douin; A. Coujou
• Keywords: Matériaux; [CHIM.MATE]Chemical Sciences/Material chemistry; 02 engineering and technology; Science des matériaux; Cristallographie; Interfacial dislocations; 0205 materials engineering; [CHIM.CRIS]Chemical Sciences/Cristallography; [PHYS.COND.CM-MS]Physics [physics]/Condensed Matter [cond-mat]/Materials Science [cond-mat.mtrl-sci]; MC2; TEM; Single-crystal superalloy; Thermal cycling creep

The effect of thermal cycling creep on the dislocation networks at the γ/γ′ interfaces in the MC2 superalloy is investigated. Tensile creep tests were performed under thermal cycling and isothermal conditions at low stress (80 MPa) and high temperature (1150 °C). In these conditions γ′ rafts may dissolve and reprecipitate during thermal cycling creep. The difference between the effects of isothermal and thermal cycling conditions on the γ/γ′ interface dislocation networks, characterized by transmission electron microscopy, is exposed, as well as their evolution during the cycle.