Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C
Interdiffusion
SLID bonding
Solder joint technology
ta213
Intermetallics
0103 physical sciences
Micro-bump
01 natural sciences
DOI:
10.1016/j.scriptamat.2022.114998
Publication Date:
2022-09-01T17:37:11Z
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