Application of Advanced Back-Side Optical Techniques in ASICs

• DOI: 10.1017/s1551929513000540
• Publication Date: 2013-05-01T15:47:51Z
• Authors: Douglas Martin; Samuel Beilin; Brett Hamilton; Darin York; Philip Baker; Wai-Yat Leung
• Keywords: Application-specific integrated circuit; Microelectronics

Failure analysis is important in determining root cause for appropriate corrective action. In order to perform failure of microelectronic application-specific integrated circuits (ASICs) delidding the device often required. However, from front side not always possible due shadowing effects caused by ASIC metal interconnects. Therefore, back-side polishing used reveal an unobstructed view silicon transistors. This paper details how conjunction with laser-scanned imaging (LSI), laser voltage (LVI), probing (LVP), photon emission microscopy (PEM), and laser-assisted alterations (LADA) were uncover two ASICs.