Effect of Condensed Water at an Alumina/Epoxy Resin Interface on Curing Reaction

• DOI: 10.1021/acs.langmuir.4c01081
• Publication Date: 2024-05-20T14:52:59Z
• Authors: Satoru Yamamoto; Yuta Tsuji; Riichi Kuwahara; Kazunari Yoshizawa; Keiji Tanaka

The adhesion of epoxy adhesives to aluminum materials is an important issue in assembling parts for lightweight mobility. Aluminum surfaces typically possess oxide layer, which readily adsorbs water. In this study, the aggregation states water and its effect on curing reaction were examined by placing a layer between amorphous alumina surface mixture amine components. This study used molecular dynamics simulations density functional theory calculations. Before reaction, molecules strongly adsorbed onto surface, aggregating excess Some diffused into epoxy/amine mixture, accelerating diffusion unreacted substances. led faster kinetics, particularly proximity surface. adsorption similarly observed even after process. Subsequently, interaction various groups was evaluated before reaction. Epoxy monomers had little with whereas hydroxy formed ring-opening exhibited notable interaction. Conversely, sulfonyl amino compounds hydrogen bonds OH However, weakened their as they transformed from primary tertiary during Both monomers/fragments interacted molecules, both insights gained are expected contribute better understanding impact moisture absorption application resins.